Am Vac Soc: CMPUG/PAG/TFUG Joint Meeting--December 9, 2009

Northern Calif Am Vac Soc (www.avsusergroups.org)
CMP USERS GROUP, PLASMA APPLICATIONS GROUP, THIN FILM USERS GROUP

FREE ADMISSION-No need to register, just show up!!
Topic: Back End Integration
Meeting Date: December 9, 2009

Location: SEMI Global Headquarters
Seminar Rooms 1, 2 & 3
3081 Zanker Road
San Jose, CA 95134
**Park in front or behind the vacant building across from SEMI**

EARLY START TIME: 1:30 - 5:00 pm
Chair: Kapila Wijekoon, Applied Materials, Kapila_wijekoon@amat.com;
Brett Cruden, NASA Ames UARC, brett.a.cruden@nasa.gov
Roc Blumenthal, roc@rocsolidsoln.com
AGENDA:
1:30-1:40 Welcome/Opening Remarks
1:40-2:10 "3D Imaging and Its Applications in CMP and Solar", Jim Xu, Zeta Technologies

2:10-2:40 "Effect of pad conditioning on CMP process performance for read
write magnetic heads", Ramin Emami, Hitachi

2:40-3:10 "Challenges in Porous Ultra Low-k for 22nm Dual Damascene Trench
Etch", K. Zhou, R. Patz, A. Darlak, Y. Zhou, J. Pender, M. Armacost, C.
Labelle, D. Horak, Applied Materials and IBM

3:10-3:30 Coffee Break

3:30-4:00 "Metallization Challenges in the Fabrication of Reliable
Interconnects for 2X Technology and Beyond", Emesh Ismail, Semitool Inc.

4:00-4:30 "Reducing Tungsten Contact and Line Resistance with advanced
Pulsed Nucleation Layer (PNLTM) and Low Resistivity Tungsten (LRW)
treatment", Raashina Humayun, Anand Chandrashekar, Feng Chen, Michal
Danek; Novellus Systems

4:30-5:00 " Effects of vacuum ultraviolet plasma emission on low-k
dielectrics", E. A. Hudson1, M. Moravej1, M. Block1, S. Sirard1, D. Wei1,
K. Takeshita1, B. Jinnai2 and S. Samukawa2, 1Lam Research Corp. and 2
Tohoku University

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Happy Holidays!!!

Re: dichlorobenzene

Hi Kyunghoae --


For good reason.  This is a suspected carcinogen and we have worked hard to eliminate it from the standard chemicals in the lab.  The industry has many greener/safer alternatives now.  It you plan to use dichlorobenzene at SNF, you must submit a SpecMat request.  In order to use it, your request would have to demonstrate that these alternative do not work for your application and that its use would be absolutely restricted.


Mary

--  Mary X. Tang, Ph.D. Stanford Nanofabrication Facility CIS Room 136, Mail Code 4070 Stanford, CA  94305 (650)723-9980 mtang@stanford.edu http://snf.stanford.edu

Kyunghoae Koo wrote:

Dear lab members

 

Does anybody know where I can purchase dichlorobenzene?

I checked with Biostore, they don’t deal with it.

Thank you.

 

Kyunghoae,

 

 

RE: dichlorobenzene

Try Sigma-Aldrich, www.sigmaaldrich.com

 

Alan Cassell

From: Kyunghoae Koo [mailto:koo1028@stanford.edu]
Sent: Monday, December 07, 2009 3:41 PM
To: labmembers@snf.stanford.edu
Subject: dichlorobenzene

 

Dear lab members

 

Does anybody know where I can purchase dichlorobenzene?

I checked with Biostore, they don’t deal with it.

Thank you.

 

Kyunghoae,

 

 

dichlorobenzene

Dear lab members

 

Does anybody know where I can purchase dichlorobenzene?

I checked with Biostore, they don’t deal with it.

Thank you.

 

Kyunghoae,

 

 

ohmic contact to Si wafer

Hi labmembers,
I would appreciate some advice.  I want to put metal vias through a 20nm oxide layer to make ohmic contact to the underlying silicon.  My wafers are degenerate n-type, resistivity < .005 ohm-cm.  I've tried evaporating titanium contacts after etching via holes through the oxide in the MRC etcher, but I see Schottky diode-like behavior, ie. an exponentially increasing IV curve.

Has anyone made ohmic contacts with a wafer of this resistivity before?  It's been suggested to me that I need to further dope the silicon to narrow the depletion region so that I have good tunneling and ohmic contact through the barrier.  I've also read that I can anneal the Ti contacts in nitrogen to form a silicide - is this something that should be done in addition to doping, or can silicide formation alone provide ohmic contact?

Thanks in advance,
Alex


Alex Neuhausen
PhD Candidate Electrical Engineering
Goldhaber-Gordon Lab
476 Lomita Mall
Stanford, CA 94305
Office: 650-725-2047
Cell: 650-776-5672

9 days to Lab Cleanup!

Greetings labmembers -

Remember, the annual lab shutdown and lab cleanup starts Wednesday, Dec.
16, at 7 am.

Starting then, any personal items in the cleanroom not inside a storage
bin will be removed from the lab. So save yourself the New Year ritual
of sifting through dozens of boxes of stuff to find your wafers or
notebook -- start collecting your personal items now!

Speaking of items in the lab, some of the WIP racks are piled up higher
than is considered safe. Please remove any items that are not being
actively processed -- or staff will begin removing them, starting with
unlabeled or undated/aged items. We won't wait for the shutdown to
start cleaning up the WIP racks. Remember, WIP stands for "Work in
Progress" not "Work in Permanence".

Finally, make sure to label storage containers kept in the CAD room
(151). Storage bins must be transparent and labeled with an active
Coral ID and current date. Unlabeled, undated, boxes and boxes older than one
year WILL BE removed and dispositioned.

Your SNF Staff

--
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
(650)723-9980
mtang@stanford.edu
http://snf.stanford.edu

Re: Problem drytek1 SNF 2009-12-06 15:50:11: the 4th on the back missing! It is really hard to get wafers out

Replaced missing pin